Precision Laser Cutting Machine for Hard Brittle Materials

Introduction to Hard and Brittle Material Laser Cutting Machines Hard and brittle material laser cutting machines are primarily used for precision laser cutting, drilling, marking, and grooving of highly brittle and hard materials, such as ceramics (zirconia, alumina), glass, sapphire, diamond, tungsten steel, quartz, and silicon wafers. Utilizing non-contact laser processing and ultra-short pulse technology, these machines effectively reduce thermal stress and microcracks during processing, ensuring smooth cutting surfaces and preserving the structural integrity of brittle materials.   Advantages of Hard and Brittle Material Laser Cutting Machines Non-contact laser processing eliminates mechanical stress and minimizes thermal impact, avoiding material cracking, delamination, discoloration, and other quality issues while retaining the material’s original properties. Achieves micron-level precision, supporting complex patterns, micro-hole drilling, and fine contour processing. Ideal f…

Precision Laser Marking Machine Precision Laser Cutting Machine