Precision PCB laser depaneling machine

The precision PCB laser depaneling machine is a high-precision device that uses a high-energy laser beam to cut and separate printed circuit boards (PCBs). Through non-contact processing, it avoids mechanical stress damage, preserving the original material properties and structural integrity. It is suitable for depaneling high-density and complex-structured PCBs such as BGA packages, QFP/BQFP chips, and micro connectors, and is widely used in consumer electronics, communication devices, automotive electronics, medical instruments, aerospace, and other fields.   Advantages of Precision PCB Laser Depaneling Machines   Achieves micron-level cutting precision with minimal heat-affected zones, ensuring smooth, burr-free edges and no mechanical stress. Eliminates issues caused by traditional cutting methods, such as component detachment, deformation, discoloration, or charring. Ideal for high-density PCBs, sensitive electronic components, and thin PCBs requiring high precision and quality. Q…

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